Moldflow Material Characterization
Beaumont Advanced Processing (BAP) is Autodesk’s® Moldflow® material characterization partner. Our lab offers gold-level material characterization and data fitting services required for the successful application of Autodesk Moldflow simulation software. As Autodesk’s preferred partner, BAP fulfills testing needs globally in both specialized proprietary Autodesk methods as well as more conventional material characterization techniques.
Accurate material characterization data leads to more accurate simulation results, leading to stronger predictions, greater confidence in design manufacturability, decreased time to market, and less time spent troubleshooting. Entrust your material characterization and testing needs to the leading global provider. Explore our available tests and get in touch with our lab today!
Place an Order
Download the order form, fill out the Moldflow Material Characterization sections, and submit it along with a material SDS to info@bapmolding.com for an official quote.
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Material Characterization Packages
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| MPL-150 | MPL-135 | MPL-130 | MPL-125 | MPL-110 | |
|---|---|---|---|---|---|
| TESTS INCLUDED | Filling, Packing, Shrinkage, +Warpage | Filling, Packing, +Shrinkage** | Filling, Packing, Shrinkage, +Warpage (non-CRIMS/STAMP model) | Filling, +Packing** | Filling* |
| Shear Viscosity by Injection Molding Rheometer (IMR) |  | | | | |
| Specific Heat | | | | | |
| Thermal Conductivity | | | | | |
| Mold Validation | | | | | |
| PvT | | | | | |
| Shrinkage Characterization (CRIMS/STAMP) | | | |||
| Coefficient of Thermal Expansion (CTE) & Mechanical Properties | | |
Package Descriptions
MPL-150 (Full Characterization)
Autodesk Moldflow Filling, Packing, Shrinkage, and Warpage
This package includes the most comprehensive material testing, and is recommended for those who are looking to have the best possible data for the most accurate simulations in any analysis type. Includes: Shear Viscosity by IMR, Specific Heat (including transition and ejection temperatures), Thermal Conductivity, PvT, CLTE and Mechanical, Shrinkage Analysis (CRIMS/STAMP), Mold Validation. Supplemental Data: N/A
MPL-135
Autodesk Moldflow Filling, Packing, and Shrinkage
For use with a full warpage simulation, but your CLTE and Mechanical data is tested internally. If provided, we will include the CLTE and Mechanical data in your final material file. Includes: Shear Viscosity by IMR, Specific Heat (including transition and ejection temperatures), Thermal Conductivity, PvT, Shrinkage Analysis (CRIMS/STAMP), Mold Validation. Supplemental Data: Mechanical (if not provided)
MPL-130
Autodesk Moldflow Filling, Packing, Shrinkage and Warpage (non-CRIMS/STAMP model)
Recommended for full warpage simulations for users not using CRIMS/STAMP model. The CRIMS/STAMP model are created from a proprietary shrinkage experiment done for improved shrinkage analysis in the simulation; without the shrinkage experiment, the software will default to the uncorrected residual stress model. Includes: Shear Viscosity by IMR, Specific Heat (including transition and ejection temperatures), Thermal Conductivity, PvT, CLTE and Mechanical, Mold Validation. Supplemental Data: N/A
MPL-125
Autodesk Moldflow Filling and Packing
Recommended primarily for pressure predictions in the mold filling simulation. Further characterization is necessary for more in-depth simulation analyses. Includes: Shear Viscosity by IMR, Specific Heat (including transition and ejection temperatures), Thermal Conductivity, PvT, Mold Validation. Supplemental Data: Mechanical
MPL-110
Autodesk Moldflow Filling
Most often used for material development, specifically for understanding the affect of formulation changes on thermal and rheological properties. The final material formulation should be characterized further for optimal simulation results. Includes: Shear Viscosity by IMR, Specific Heat (including transition and ejection temperatures), Thermal Conductivity, Mold Validation. Supplemental Data: PvT and Mechanical